Intel News Release
Intel Shifts Future Core™ Processors Into Turbo Mode
Latest Processors, Mobile Platforms and Technologies Showcased at IDF
INTEL DEVELOPER FORUM, San Francisco, Aug. 19, 2008 – In his Intel Developer Forum keynote today, Pat Gelsinger detailed the roadmap for Intel's continued march toward pervasive, higher performance and power efficient computing. The senior vice president and general manager of Intel's Digital Enterprise Group discussed new features of the company's next-generation processor family including a new turbo mode that shifts the processor into a higher gear for mind-blowing performance without a heat penalty.
The company's first desktop PC chips branded Intel® Core™ i7 processors and initial energy-efficient, high-performance server products (codenamed "Nehalem-EP") will be first to production. Intel is also planning to manufacture a second server derivative designed for the expandable sever market ("Nehalem-EX"), and desktop ("Havendale" and "Lynnfield") and mobile ("Auburndale" and "Clarksfield") client versions in the second half of 2009.
"Our engineers have put together an incredible processing family here that will include a tremendous amount of new processor features all centered on delivering faster computer performance and terrific energy efficiency," Gelsinger said.
The next-generation Core microarchitecture also features Intel® Hyper-Threading Technology* delivering up to 8-threaded performance capability on 4 cores in the initial versions and best-in-class memory bandwidth thanks to the new QuickPath Interconnect. QuickPath is a technology that connects processors, chipsets and memory together, and delivers up to three times the memory bandwidth of previous generation Core microarchitecture solutions.
The new Intel® Xeon® processor X7460 with 6 cores and 16MB L3 cache for expandable servers launching in September has already broken multiple performance world records1. An 8-socket IBM System x* 3950 M2 server became the first platform to break the 1 million tpmC barrier on the TPC*-C benchmark. New 4-Socket performance records include TPC*-C on HP Proliant* DL580 G5, TPC*-E on Dell PowerEdge* R900, SPECjbb*2005 on Sun Fire* X4450 and SPECint*_rate2006 on Fujitsu-Siemens PRIMERGY* RX600 S4.
Gelsinger also discussed the industry's first many-core Intel Architecture (IA) based design, codenamed "Larrabee." Expected in 2009 or 2010, the first product based on Larrabee will target the personal computer graphics market, support DirectX and OpenGL, and run today's games and programs. Larrabee is expected to kick start an industry-wide effort to create and optimize software for the dozens, hundreds and thousands of cores expected to power future computers.
The Intel executive also outlined Intel's vision for the next wave of the Internet, called the Embedded Internet. Emerging markets in the embedded computing space such as IP networking and security, video intelligence, medical, in-vehicle infotainment and home automation can greatly benefit from the always-on Internet connectivity. Gelsinger said that this area is another growth opportunity for Intel and the high-tech industry, and predicted that there will be 15 billion devices connected to the Internet as a result of the rapid rise of the embedded Internet.
Where Will Mobile Computing's "On-the-Go, Go?"
Showing the breadth and health of Intel's next-generation processors, David (Dadi) Perlmutter, executive vice president and general manager of Intel's Mobility Group today demonstrated the first working laptop platform codenamed "Calpella."
"Calpella will redefine how we compute on-the-go by giving users a stunning new computing visual experience, better manageability and security, enhanced turbo mode features and evolutionary power management for notebooks," said Perlmutter. "It is all about dramatic mobile performance without compromise."
New Mobile Processors Unveiled
Building on the recent Intel Centrino® 2 launch for notebook PCs in July, Perlmutter unveiled Intel's first-ever mobile-focused quad-core laptop workstation – the Intel® Core™2 Extreme processor. While the products include four cores, they only use 45 watts of power.
Perlmutter also introduced the company's second-generation dual-core mobile processors for increasingly popular ultra thin and light notebook PCs.
He also outlined upcoming mobile platform enhancements including the Intel High-Performance SATA Solid-State Drive product line for faster system responsiveness, lower power consumption and rugged, reliable operation and available later this year, Intel® Anti-Theft Technology, which features intelligent hardware-based detection and response mechanisms that enable IT managers or service providers to disable the platform and/or access to data in case of loss or theft.
WiMAX Connecting Soon
Emerging WiMAX 4G networks around the world will be connecting the plethora of mobile platforms and devices, and specifically within the United States where Sprint XOHM* plans to turn on its first citywide network in Baltimore in September. Globally, more than 400 WiMAX trials and networks2 extend the richness of the mobility experience. Perlmutter also announced that Dell has now joined other computer-makers such as Acer, Asus, Lenovo, Panasonic, and Toshiba as publicly committing to include the Intel® WiMAX/WiFi Link 5050 Series module to future laptop product lines.
Barrett: "Get involved"
During the conference's opening keynote, Intel Chairman Craig Barrett applauded the developer community for technology innovations that contributed to unimagined advances in entertainment and business productivity during the past 40 years. He said the impact of their work is borderless and challenged them to collaborate and use their technology expertise to inspire and empower the billions of people who have recently joined the world's free economic system.
"Technology is a tool to address some of the world's most pressing challenges related to health care, education, economic development and the environment," said Barrett, who also chairs a United Nations initiative on technology in the developing world. "No nations or individuals are untouched by these issues. Get involved. Be part of the solution."
Barrett also announced that Intel will award four $100,000 prizes to the most innovative ideas for applying technology to meet unmet needs related to education, health care, economic development and the environment. Ideas will be evaluated for sustainability and innovativeness of the solution. More details on the INSPIRE•EMPOWER Challenge are available at www.intelchallenge.com.
About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.
Intel is a trademark of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of their respective owners. SPEC, SPECint, SPECfp, SPECrate, SPECweb, SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See: http://www.spec.org for more information on the benchmarks.
Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http://www.intel.com/performance/resources/limits.htm or call (U.S.) 800-628-8686 or 916-356-3104.
1 World record claims based on comparison using published results as of August 19, 2008 on x86 architecture based 4-socket or 8-socket systems as appropriate. Configuration Details: Details of performance results and configuration information posted at http://www.intel.com/performance/server/xeon_mp/summary.htm.
2 Source: www.wimaxcounts.com Maravedis, 2008.
Wednesday, January 14, 2009
Intel News Release
Intel News Release
Intel CTO Says Gap between Humans, Machines Will Close by 2050
INTEL DEVELOPER FORUM, San Francisco, Aug. 21, 2008 – Intel Corporation's chief technology officer took a fascinating look at how technology will bring man and machine much closer together by 2050.
Justin Rattner, during his keynote today at the Intel Developer Forum in San Francisco, predicted big changes are ahead in social interactions, robotics and improvements in computer's ability to sense the real world. He said Intel's research labs are already looking at human-machine interfaces and examining future implications to computing with some promising changes coming much sooner than expected.
"The industry has taken much greater strides than anyone ever imagined 40 years ago," Rattner said. "There is speculation that we may be approaching an inflection point where the rate of technology advancements is accelerating at an exponential rate, and machines could even overtake humans in their ability to reason, in the not so distant future."
Cutting the Last Cord, Wireless Power
Imagine being able to walk into an airport or room with your laptop and instead of consuming battery, it is recharged. Based on principles proposed by MIT physicists, Intel researchers have been working on a Wireless Resonant Energy Link (WREL). Rattner demonstrated powering a 60-watt light bulb without the use of a plug or wire of any kind, which is more than is needed for a typical laptop.
The magic of WREL is that it promises to deliver wireless power safely and efficiently. The technology relies on strongly coupled resonators, a principle similar to the way a trained singer can shatter a glass using her voice. At the receiving resonator's natural frequency, energy is absorbed efficiently, just as a glass absorbs acoustic energy at its natural frequency. With this technology enabled in a laptop, for example, batteries could be recharged when the laptop gets within several feet of the transmit resonator. Many engineering challenges remain, but the company's researchers hope to find a way to cut the last cord in mobile devices and someday enable wireless power in Intel-based platforms.
Programmable Matter: Computers that Change Shape
Intel researchers are also investigating how millions of tiny micro-robots, called catoms, could build shape-shifting materials. If used to replace the case, display and keyboard of a computing device, this technology could make it possible for a device to change physical form in order to suit the specific way you are using it. A mobile computer, for example, could be tiny when in a pocket, change to the shape of an earpiece when used as a mobile phone, and be large and flat with a keyboard for browsing the Internet or watching a movie.
Rattner described this as a difficult exploratory research agenda, but steady progress is being made. He demonstrated for the first time the results of a novel technique for fabricating tiny silicon hemispheres using photolithography, a process used today to make silicon chips. This capability is one of the basic structural building blocks needed to realize functional catoms, and will make it easier to bring the necessary computational and mechanical components together in one tiny package less than a millimeter across. The technique is compatible with existing high-volume manufacturing and enables the possibility to produce such catoms in quantity at some point in the future.
Dr. Michael Garner, program manager of Emerging Materials Roadmap, joined Rattner onstage to discuss the importance of research of novel silicon technology, keeping Moore's Law alive and well through the next decade and beyond. Among other things, Intel is researching how to go beyond planar transistors to 3D transistors and is looking at using compound semiconductors to replace silicon in the transistor channel. Looking further out, Intel is exploring into a variety of non-charge-based technologies that could one day replace CMOS altogether.
Robots: From the Factory Floor to Your Kitchen
Robots today are primarily used in the factory environment, designed to perform a single task repeatedly and bolted down. To make robotics personal, robots need to move and manipulate objects in cluttered and dynamic human environments, according to Rattner. They need to be cognizant of their surroundings by sensing and recognizing movement in a dynamic physical world, and learn to adapt to new scenarios. Rattner demonstrated two working personal robot prototypes developed at Intel's research labs. One of the demonstrations showed electric field pre-touch that has been built into a robot hand. The technique is a novel sensing modality used by fish but not humans, so they can "feel" objects before they even touch them. The other demonstration was a complete autonomous mobile manipulation robot that can recognize faces and interpret and execute commands as generic as "please clean this mess" using state-of-the-art motion planning, manipulation, perception and artificial intelligence.
In addition to robots becoming more human-like, Rattner said he believes more innovation will emerge to make human and machine interaction more robust. Randy Breen, chief product officer of Emotiv Systems, joined Rattner onstage to demonstrate the company's EPOC* headset. The Emotiv EPOC identifies brainwave patterns, processes them in real time and tells a game what conscious or non-conscious thoughts the user has had, like facial expressions, conscious actions or emotions. A user with the headset could think about smiling or lifting an object, and an avatar in a game would execute it. EPOC can currently identify more than 30 different "detections" through the 16 sensors on the headset.
About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.
Intel is a trademark of Intel Corporation in the U.S. and other countries.
**Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
*Other names and brands may be claimed as the property of others.
